Cogent.design: https://cogent.design/
The Cogent.design Odroid C2 case is a heatsink + metal case, built into one complete and gorgeous unit:
How does it perform as case?
Positives:
- Its a heatsink and case, all built into one.
- Although the CPU will transfer all heat to the case, other components will heat up. This has been thought out well in the case design and features various slots and holes for air ventilation
- The metal finish on the exterior of the case is exceptional, with a glistening brushed finish and no sharp edges, high quality craftsmanship throughout and it shows.
- The thickness of the metal is roughly 3mm thick, its extremely high quality and exceptionally strong.
- There is also a satisfying weight to the case, it feels like its built to last.
- The case is provided with 4 adhesive, soft gel feet pads to prevent slip.
- There is only 2 parts to the case, a top and bottom.
- Both the top and bottom parts of the case, appear to be created from a single mold with no additional welding.
- No EMMC access has been built into the design. Would require removal of the bottom section for access. EDIT: Upgrade case with EMMC access: https://cogent.design/?product=odroid-c ... -enclosure
- There is no access to GPIO built into the case design. The top section would need to be removed for access.
How does it perform as a heatsink?
When we consider the heat will be dissipated through the whole case, with a large surface area, one should expect great results.
Lets run some CPU stress tests:
I ran two Odroid C2's at the same time, one with the Cogent.design case, and the other with the stock heatsink and case from Odroid.
Code: Select all
apt-get install -y stress
stress -c $(nproc --all) -t 600 &
while (( $(ps aux | grep -ci -m1 '[s]tress') )); do echo -e "$(date) | $(( $(cat /sys/class/thermal/thermal_zone0/temp) / 1000 ))'c"; sleep 1; done
- Idle temps:
- Cogent.design Case = 29'c
- Stock heatsink/case = 44'c
- Max temps reached from stress test:
- Cogent.design Case = 47'c
- Stock heatsink/case = 75'c
Guide:
Step 1: Remove the stock heatsink:
First you need to remove the pins:
- From the top of the board, push one pin down.
- Use a pair of tweezers to "squash" the bottom sides of the pin.
- Release the pin and tweezers. If successful the pin will exit through the hole on release.
- Get your girlfriends hair dryer and heat up the heatsink.
- Once the heatsink is warm, gently twist the heatsink in both directions.
- Repeat the process several times.
- Over time it will become lose and can easily removed.
We must remove all residue left on by the stock heatsink and thermal compound:
- Grab your girlfriends nail varnish remover and some cotton wool buds.
- Place a small amount of the nail varnish on the cotton wool pad.
- Gently rub the s905 chip with the bud, until all reside is removed.
- Dry the s905 chip by using a clean cotton wool bud to remove all remaining nail varnish.
This is required to give maximum heat dissipation efficiency through both surfaces:
NOTE: Although I was provided with a thermal compound, I decided to use a Akasa thermal adhesive pad instead as I want a permanent attachment.
Here is the method I used to complete the case build, to achieve a dead centre board alignment with case:
- Place the Odroid C2 on the bottom section of the case, line up the holes.
- Push all the 4 bottom screws, through the bottom of the case so they are visible from the top. This will ensure the case and board alignment is perfect.
- Line up the top section of the case and gently place it on top of the bottom section.
When the top section touches the screws, gently lift the whole case up. The screws will fall out and you should be left with a perfect allignment. - Gently press the bottom and top section together and ensure its flush.
- Now you can insert the screws and fix it into place.
(ambient 19C)